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Transient of thermal stresses in printed circuit boards
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| Title: | Transient of thermal stresses in printed circuit boards | ||||||||||
| Author: | Šuba, Oldřich; Sýkorová, Libuše | ||||||||||
| Document type: | Peer-reviewed article (English) | ||||||||||
| Source document: | International Journal of Mechanics. 2011, vol. 5, issue 3, p. 226-233 | ||||||||||
| ISSN: | 1998-4448 (Sherpa/RoMEO, JCR) | ||||||||||
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| Full text: | http://www.naun.org/multimedia/NAUN/mechanics/20-861.pdf | ||||||||||
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ČSN ISO 690:2011 citation
Citace článku v časopise:
ŠUBA, Oldřich a Libuše SÝKOROVÁ. Transient of thermal stresses in printed circuit boards. International Journal of Mechanics [online]. 2011, vol. 5, iss. 3, s. 226-233. [cit. 2025-11-03]. ISSN 1998-4448. Dostupné z: http://www.naun.org/multimedia/NAUN/mechanics/20-861.pdf.
These citations are software generated and may contain errors. To verify accuracy, check the appropriate style guide.
ŠUBA, Oldřich a Libuše SÝKOROVÁ. Transient of thermal stresses in printed circuit boards. International Journal of Mechanics [online]. 2011, vol. 5, iss. 3, s. 226-233. [cit. 2025-11-03]. ISSN 1998-4448. Dostupné z: http://www.naun.org/multimedia/NAUN/mechanics/20-861.pdf.
These citations are software generated and may contain errors. To verify accuracy, check the appropriate style guide.
