Characterization of ultra-thin tungsten layers

Martínek, Tomáš; Kudělka, Josef; Navrátil, Milan; Fořt, Tomáš; Křesálek, Vojtěch

Title:

Author:

Martínek, Tomáš; Kudělka, Josef; Navrátil, Milan; Fořt, Tomáš; Křesálek, Vojtěch

Document type:

Peer-reviewed article (English)

Source document:

International Journal of Applied Engineering Research. 2016, vol. 11, issue 11, p. 7523-7525

ISSN:

0973-4562 (Sherpa/RoMEO, JCR)

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Abstract:

Atomic force microscopy and surface resistivity measurement were used for characterization of ultra-thin tungsten layers deposited on purified silicon with 200 nm thermic silicon dioxide substrate. Radio-frequency magnetron sputtering was used for tungsten deposition. © Research India Publications.

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https://www.ripublication.com/Volume/ijaerv11n11.htm

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Citace článku v časopise:
MARTÍNEK, Tomáš, Josef KUDĚLKA, Milan NAVRÁTIL, Tomáš FOŘT a Vojtěch KŘESÁLEK. Characterization of ultra-thin tungsten layers. International Journal of Applied Engineering Research [online]. 2016, vol. 11, iss. 11, s. 7523-7525. [cit. 2025-10-30]. ISSN 0973-4562. Dostupné z: https://www.ripublication.com/Volume/ijaerv11n11.htm.

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